| AUTOMATIC SPUTTER COATER | |
|---|---|
| Chamber size | 150mm Ø Variable height, 165mm - 250mm |
| Sputter head | Low voltage planar magnatron Quick target change Wrap-around dark-space shield Target shutter |
| Sputter target | Cr, Pt/Pd as standard (Ta, Au, Au/Pd, Pt or W optional) |
| Sputter supply | Microprocessor based Safety interlocked Current control independent of vacuum Digitally selectable current (20, 40, 60 or 80mA) |
| Sample stage | Non-repetitive rotary planetary motion with manual tilt 0 - 90° Variable speed rotation Crystal head 4 sample holders |
| Analogue metering | Vacuum, Atm - 0.001mb Current, 0 - 50mA |
| Control method | Automatic operation of gas purge and leak functions Automatic process sequencing Full manual override Digital timer, 5 - 300 seconds with pause Automatic vent |
| Thickness controll | MTM-20 with termination facility |
| PUMPING SYSTEM | |
| Configuration | Turbo-drag/rotary pump combination Optional diaphragm pump instead of rotary pump |
| Pumping speed | 300 litres/min @ 0.1m |
| Pumpdown time | 1 min. to 1x10-3mb (1.5 min. with diaphragm pump option) |
| Ultimate pressure | 1x10-5mb |
| Desktop system | Rotary pump is mounted on desktop compatible anti-vibration table All metal vacuum coupling system |
| THICKNESS MONITOR | |
| MTM-20 | Microprocessor based 4 digit display with push button zero 5 times/sec. display update rate 6 MHz crystal with life-time check |
| Thickness range | 0 - 999.9nm |
| Resolution | Better than 0.1nm |
| Density range | 0.50 - 30.00gm/cm3 |
| Tooling factor range | 0.25 - 8.00 |
| Termination range | 0 - 999.9nm |
| SERVICE REQUIRED | |
| Supply | 100 - 120 or 200 - 240 VAC, 50/60Hz (specify on order) |
| Power | 550 VA max |
| Argon gas | Purity, min. 99.9% Pressure, regulated 7 - 8 psi (0.5 - 0.6 bar) Hose connection, 6.0mm |
